| Housing geometry |
Cast and machined. Reshaping it is a new tool, not a change order. |
Nothing on a library model — a private mould is a separate programme. |
| Optic & beam |
Lens position and reflector family. |
Beam mix and spot-to-flood ratio within that family. |
| LED & output |
Footprint and thermal budget of the head. |
Bin selection, colour temperature, output levels, runtime targets. |
| Driver |
Board outline and mounting points. |
Mode logic, level spacing, lock function, indicator behaviour. |
| Battery |
Pack bay volume and connector. |
Capacity inside the bay, cell supplier, charging current. |
| Finish |
Substrate and coating process. |
Colourway, anodised or painted, two-tone, texture. |
| Branding |
Nothing is moulded in — every mark is added. |
Laser mark, bezel engraving, band print, label, manual. |
| Packaging |
None. |
Box or blister, insert, artwork, barcode, languages. |
| Accessories |
None. |
Charger, cable, spare band, carry bag, mount kit. |
| Market & compliance |
None. |
Destination market, responsible person, marks and label copy. |